Celcon® LW90-S2
乙缩醛（POM）共聚物
Ticona

产品说明

Celcon® LW90-S2 is a preblended low wear formulation of M90 base polymer containing 2% silicone. This standard low friction, low wear product performs well in many applications including those involving intermittent motion.

总体

材料状态 • 已商用：当前有效  
供货地区 • 北美洲 • 拉丁美洲 • 南美洲
添加剂 • 硅酮润滑剂 (2%)  
性能特点 • 低摩擦系数 • 经润滑 • 耐磨损性良好
RoHS 合规性 • 联系制造商  
形式 • 颗粒料  
加工方法 • 注射成型  
多点数据 • Isothermal Stress vs. Strain (ISO 11403-1) 

物理性能 额定值单位制 测试方法
比重  
-- 1.40g/cm³ ASTM D792
-- 1.38g/cm³ ISO 1183
溶化体积流率（MVR） (190°C/2.16 kg) 8.40cm³/10min ISO 1133
收缩率  
流动 2.2% ASTM D955
横向流动 1.8% ASTM D955
横向流量 1.6% ISO 294-4
流量 1.9% ISO 294-4
机械性能 额定值单位制 测试方法
拉伸模量 2500MPa ISO 527-2/1A/1
抗张强度  
屈服, 23°C 51.0MPa ASTM D638
屈服 56.0MPa ISO 527-2/1A/50
拉伸应变 (屈服) 10% ISO 527-2/1A/50
弯曲模量  
23°C 2410MPa ASTM D790
23°C 2400MPa ISO 178
冲击性能 额定值单位制 测试方法
简支梁缺口冲击强度  ISO 179/1eA
-30°C 4.5kJ/m² 
23°C 7.0kJ/m² 
悬壁梁缺口冲击强度  
23°C 75J/m ASTM D256
23°C 5.3kJ/m² ISO 180/1A
热性能 额定值单位制 测试方法
热变形温度  
1.8 MPa, 未退火 110°C ASTM D648
1.8 MPa, 未退火 94.0°C ISO 75-2/A
维卡软化温度 161°C ISO 306/B50
熔融温度  
-- 2 166°C ISO 11357-3
-- 165°C ASTM D3418
线形膨胀系数  ISO 11359-2
流动 0.00011cm/cm/°C 
横向 0.00012cm/cm/°C 
电气性能 额定值单位制 测试方法
体积电阻率 1.0E+14ohm•cm ASTM D257
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Celcon® LW90-S2 2012年10月14日
乙缩醛（POM）共聚物 
Ticona 
注射 额定值单位制
加工（熔体）温度 182 到 199°C
模具温度 82.0 到 93.0°C
注射说明 

Standard reciprocating screw injection molding machines with a high compression screw (minimum 3:1 and preferably 4:1) and low back pressure (0.35 Mpa/50 PSI) are favored. Using a low compression screw (I.E. general purpose 2:1 compression ratio) can result in unmelted particles and poor melt homogeneity. Using a high back pressure to make up for a low compression ratio may lead to excessive shear heating and deterioration of the material.

Melt Temperature: Preferred range 182-199 C (360-390 F). Melt temperature should never exceed 230 C (450 F).

Mold Surface Temperature: Preferred range 82-93 C (180-200 F) especially with wall thickness less than 1.5 mm (0.060 in.). May require mold temperature as high as 120 C (250 F) to reproduce mold surface or to assure minimal molded in stress. Wall thickness greater than 3mm (1/8 in.) may use a cooler (65 C/150 F) mold surface temperature and wall thickness over 6mm (1/4 in.) may use a cold mold surface down to 25 C (80 F). In general, mold surface temperatures lower than 82 C (180 F) may hinder weld line formation and produce a hazy surface or a surface with flow lines, pits and other included defects that can hinder part performance.

备注
1 一般属性：这些不能被视为规格。

2 10°C/min

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