Hostaform® EC140XF
乙缩醛（POM）共聚物

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产品说明

Hostaform® EC140XF is a conductive ESD grade of acetal copolymer for applications requiring dissipation of static build-up. EC140XF has an 
improved resistance to aggressive fuel blends.   
总体    
材料状态 • 已商用：当前有效   
供货地区 • 北美洲 • 拉丁美洲 • 欧洲 
 • 非洲和中东 • 南美洲 • 亚太地区 
    
性能特点 • 导电 • 静电放电保护 • 耐油 
 • 共聚物 • 抗静电性  
    
RoHS 合规性 • 联系制造商   
加工方法 • 注射成型   

物理性能 额定值单位制 测试方法
密度 1.42g/cm³ ISO 1183
溶化体积流率（MVR） (190°C/2.16 kg) 4.00cm³/10min ISO 1133
收缩率  ISO 294-4
横向流量 1.9% 
流量 2.1% 
机械性能 额定值单位制 测试方法
拉伸模量 2700MPa ISO 527-2/1A/1
拉伸应力 (屈服) 51.0MPa ISO 527-2/1A/50
拉伸应变  ISO 527-2/1A/50
屈服 4.7% 
断裂 12% 
弯曲模量 (23°C) 2650MPa ISO 178
冲击性能 额定值单位制 测试方法
简支梁缺口冲击强度 (23°C) 4.0kJ/m² ISO 179/1eA
简支梁缺口冲击强度 (23°C) 70kJ/m² ISO 179/1eU
热性能 额定值单位制 测试方法
热变形温度  
0.45 MPa, 未退火 152°C ISO 75-2/B
1.8 MPa, 未退火 91.0°C ISO 75-2/A
维卡软化温度 148°C ISO 306/B50
熔融温度 2 166°C ISO 11357-3
线形膨胀系数  ISO 11359-2
流动 0.00010cm/cm/°C 
横向 0.00011cm/cm/°C 
电气性能 额定值单位制 测试方法
表面电阻率 1.0E+3ohm IEC 60093
体积电阻率 5.0E+2ohm•cm IEC 60093
  
注射 额定值单位制 
加工（熔体）温度 182 到 199°C 
模具温度 82.0 到 93.0°C 
注射说明  

Standard reciprocating screw injection molding machines with a high compression screw (minimum 3:1 and preferably 4:1) and low back pressure (0.35 Mpa/50 PSI) are favored. Using a low compression screw (I.E. general purpose 2:1 compression ratio) can result in unmelted particles and poor melt homogeneity. Using a high back pressure to make up for a low compression ratio may lead to excessive shear heating and deterioration of the Hostaform® material.

Melt Temperature: Preferred range 182-199 C (360-390 F). Melt temperature should never exceed 230 C (450 F).
Mold Surface Temperature: Preferred range 82-93 C (180-200 F) especially with wall thickness less than 1.5 mm (0.060 in.). May require mold temperature as high as 120 C (250 F) to reproduce mold surface or to assure minimal molded in stress. Wall thickness greater than 3mm (1/8 in.) may use a cooler (65 C/150 F) mold surface temperature and wall thickness over 6mm (1/4 in.) may use a cold mold surface down to 25 C (80 F). In general, mold surface temperatures lower than 82 C (180 F) may produce a hazy surface or a surface with flow lines, pits and other included defects.

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Hostaform® EC140XF 2012年10月6日
乙缩醛（POM）共聚物

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备注
1 一般属性：这些不能被视为规格。

2 10°C/min